Sputtering Systems

The KS family of Sputtering Systems includes both horizontal and vertical cathode/target orientation and has been designed to meet stringent requirements of versatility and modularity.
Low cost of ownership and a wide range of substrate handling facilities are a common feature of all the KS sputtering systems.



  • KS Horizontal (sputter down) series
  • KS 500 H Dual chamber
  • KS Vertical series
  • KS confocal series



  • Vertical or Horizontal Design
  • DC/RF high deposition rate magnetron cathodes
  • Automatic shutters
  • Substrate RF or DC bias
  • Turbomolecular or cryogenic pumping system
  • New generation control and software management. PC with touch screen
  • Process gas lines with MFC
  • Low maintenance costs. Low service costs. Easy upgrade
  • Confocal design



  • Reactive and multi-cathode co-sputtering processes
  • Single or multi-layers deposition
  • Metallic and dielectric coatings for microelectronics and photonics
  • Optical, tribological, protective and decorative coatings
  • Magnetic films, sensors, actuators
  • EM shields and anti-static coatings for PC and telephones
  • Arospace, automotive, defence
  • Energy and environment (catalysis, solar and fuel cells)
  • Magnetic films
  • Safety and health


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