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Sputtering System
The KS family of Sputtering Systems includes both horizontal and vertical cathode/target orientation and has been designed to meet stringent requirements of versatility and modularity.
Low cost of ownership and a wide range of substrate handling facilities are a common feature of all the KS sputtering systems.
Models:
- KS Horizontal (sputter down) series
- KS 500 H Dual chamber
- KS Vertical series
- KS confocal series
Features:
- Vertical or Horizontal Design
- DC/RF high deposition rate magnetron cathodes
- Automatic shutters
- Substrate RF or DC bias
- Turbomolecular or cryogenic pumping system
- New generation control and software management. PC with touch screen
- Process gas lines with MFC
- Low maintenance costs. Low service costs. Easy upgrade
- Confocal design
Applications:
- Reactive and multi-cathode co-sputtering processes
- Single or multi-layers deposition
- Metallic and dielectric coatings for microelectronics and photonics
- Optical, tribological, protective and decorative coatings
- Magnetic films, sensors, actuators
- EM shields and anti-static coatings for PC and telephones
- Arospace, automotive, defence
- Energy and environment (catalysis, solar and fuel cells)
- Magnetic films
- Safety and health
