Atomic Layer Deposition (ALD) allows VERY ACCURATE UNIFORMITY and HIGH DENSITY. KENOSISTEC developed its own design ALD based on customer specific process and requirements. This can be INTEGRATED in customized solution to be offered as a TURNKEY EQUIPMENT.
Pulsed Laser Deposition (PLD) is a deposition technique SPECIFICALLY DESIGNED to operate in a UHV environment. The EASINESS of the technique and the POSSIBILITY to TUNE SEVERAL experimental parameters, makes PLD extremely versatile.
This technique offers a number of advantages, all of which arise from the self-limiting, sequential reactions.
Film thickness is WELL CONTROLLED and EXCELLENT UNIFORMITY can be achieved across the SURFACE.
This technique is used where other techniques have been problematic or have failed to make the deposition.
PLD advantages are:
- ALMOST NO RESTRICTIONS on the material to be used as target
- Great thickness UNIFORMITY
KENOSISTEC will be glad to assist in the selection of the proper PLD or ALD tool for your particular application. CONTACT US and let us to know your requirements.
KENSISTEC develop PLD equipment and processes that result in products of high value to the customer.
Each system can be equipped with an in-situ monitoring as, for example, a REED.
Sputtering is a LOW TEMPERATURE- HIGH ENERGY PVD process, where the target bombarded by ions, is vaporized and the vapours are deposited on the substrate creating a thin atomic layer.
Evaporation is a LOW ENERGY PVD process and HIGH DEPOSITION rate where the material is heated based on the concept that above any material exists a finite “vapor pressure” .
The PVD technologies can be COMBINED in a POLYVALENT SOLUTION where two or more processes are required on a substrate, always keeping a clean deposition environment.
Heaters and Coolers, Manipulators and special mechanical devices can be engineered under request.