Country and language:
Website:
R&D Systems

ALD systems (Atomic layer deposition) and PLD systems (Pulsed laser deposition)

ALD

Atomic Layer Deposition (ALD) is a technology that allows you to deposit high-density material, ensuring accurate uniformity.


It is a method of sequential deposition - layer by layer - on an activated substrate surface. ALD technology allows the layers to be fused continuously through the use of liquid precursors activated by plasma or by temperature.


KENOSISTEC has developed its own ALD design, refining it according to customer specific processes and requirements. The system can be integrated into existing solutions.


Thanks to sequential self-limiting reactions, which ensure careful control of the coating size, the ALD technique offers numerous advantages.

The most important are:

  • High control of the film thickness
  • Excellent uniformity over the entire surface
  • Coating also of internal or hardly accessible surfaces

KENOSISTEC accompanies the customer in choosing the most appropriate ALD tool for each individual application. Furthermore, each system can be equipped with continuous monitoring such as, for example, a Reed, a normally open foil switch which closes in the presence of a magnetic field.


PLD

Pulsed laser deposition uses a high-powered pulsed laser to irradiate the target material, producing a jet of material that is collected on a suitable substrate, typically heated to a high temperature.



Pulsed laser deposition (PLD) is a deposition technique specifically designed to operate in a UHV (i.e. Ultra High Vacuum) environment.

It is extremely versatile because it is simple and adaptable on the basis of various experimental parameters.

PLD technology is used where others have encountered difficulties or have not been able to carry out the deposition.

The advantages related to the use of the PLD are:

  • Flexibility on the type of material to be used as a target
  • Great uniformity of thickness


Thanks to a high-end offer for PLD equipment and processes, KENOSISTEC accompanies the customer in choosing the most appropriate Pulsed Laser Deposition tool for their needs.


Related products
    pvd-sputtering-equipment-kenosistec
    Sputtering Systems

    Sputtering is a low-temperature, high-energy PVD process in which a target is bombarded with ions and vaporized, before being deposited on a substrate in the form of a thin atomic layer.

    e-beam-and-thermal-evaporation-systems-kenosistec
    Evaporation System

    The evaporation is a PVD process with low energy and high speed of deposition in which the solid material is finely heated at the rate of the evaporation state.In a second moment, the vapor thus o...

    combined-coating-technologies-systems-kenosistec
    PVD systems with combined technologies

    Different techniques for thin film deposition can be applied in a polyvalent solution in cases where two or more processes are required on the same substrate, always maintaining a clean deposition env...

    thin-film-deposition-components-kenosistec
    Components for thin film deposition

    From magnetron sources and cathode arc evaporation sources to power supplies: thanks to our vast experience in the production of vacuum systems, we offer the market the best components designed and ma...

Contact us
  • Viale delle scienze, 23, 20082 Binasco MI
  • Tel +39 02 9055200