Cathodic ARC Equipment
A well known PVD technique since more that 100 years. Widely used on Research & Development applications and then moved to the HARD and DECORATIVE coating industries, where ENHACED ADHESION and COVERAGE specially in complex geometies are required.
HIGH and EFFICIENT PRODUCTION of metal plasma, excellent film properties as well as the range of type of materials that can be produced is impressive and growing.
- The CHAMBER is water cooled and it can be provided with SINGLE or DOUBLE ROTATION substrates holder, to coat flat or 3-D samples.
Each CONFIGURATION can be supplied with the following features:
- SUBSTRATES can be HEATED up to 400°C.
- Substrates holder INSULATED for BIASING and PLASMA cleaning.
- ARC SOURCES: 63 mm or 100 mm diameter (own design)
OPTIONAL PLASMA Ion Source for non-conductive substrates cleaning.
R.I.E (Reactive Ion Etching) / IBE ( Ion Beam Etching) is an ION-ASSISTED REACTIVE method based on a combination of chemical and physical etching which allows isotropic and anisotropic (uni-directiona...
The PVD technologies can be COMBINED in a POLYVALENT SOLUTION where two or more processes are required on a substrate, always keeping a clean deposition environment.
The best SOLUTION to avoid cross contamination in a MULTI PROCESS DEPOSITION-inclusive running at the same time-several chambers .
Heaters and Coolers, Manipulators and special mechanical devices can be engineered under request.