PVD systems with combined technologies
The strength of this configuration is the inclusion of the advantages and peculiarities of each deposition technique used within the same vacuum chamber, or in a chamber interconnected by means of a load-lock mechanism, to achieve the best possible coating performance.
The Kenosistec team is always available to identify the most suitable solution among the many combination possibilities, according to specific needs.
Some examples of combination of PVD technologies:
- HiPims, dual magnetron sputtering with cathode arc evaporation sources.
The combination is specially designed to offer the best results for tribology coatings.
- Sputtering, thermal evaporation and e-beam.
The solution is optimized for optics and microelectronics.
- Sputtering and PECVD.
With this configuration it is possible to obtain a thin PVD film and a protective layer.
- Sputtering and PLD.
The performance of standard sputtering is improved by adding higher density layers of different materials.
- ALD, PLD etching and sputtering.
The combination is ideal for microelectronics, nanosensors, mems.
Contact our engineering team for more information.
Sputtering is a low-temperature, high-energy PVD process in which a target is bombarded with ions and vaporized, before being deposited on a substrate in the form of a thin atomic layer.
The evaporation is a PVD process with low energy and high speed of deposition in which the solid material is finely heated at the rate of the evaporation state.In a second moment, the vapor thus o...
Cathodic arc deposition is a high energy PVD evaporation process with a high deposition rate, mainly used with low heat conduction metals.
From magnetron sources and cathode arc evaporation sources to power supplies: thanks to our vast experience in the production of vacuum systems, we offer the market the best components designed and ma...
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