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R&D Systems

Combined Technologies Systems

The strength is to INCLUDE the advantages and peculiar properties of EACH DEPOSITION technique IN THE SAME VACUUM CHAMBER or INTERCONNECTED chamber by a vacuum transfer mechanism ( i.e load-lock) to reach the BEST POSSIBLE COATING PERFORMANCES.

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  • coating-technologies-combined-systems-kenosistec

Combined in a SIMPLE-TO-USE configuration becoming the PERFECT ALLY for ACADEMIC and INDUSTRIAL, RESEARCH and TRAINING LABORATORIES. 

  • HiPIMS, DUAL magnetron sputtering with Cathodic Arch Evaporation Sources; especially designed to offer the best results for tribology coatings.
  • Sputtering, Thermal and E-beam evaporation; great results for optics and microelectronic field.
  • Sputtering and PECVD; fine properties of PVD film and an AR-protective layer.
  • Sputtering and PLD; increased performance of standard sputtering by adding higher density layers of different materials.
  • ALD, PLD Etching and Sputtering; Microelectronic, Nanosensors, Mems

CONTACT our Engineering team  to obtain additional information.

Related products
    pvd-sputtering-equipment-kenosistec
    Sputtering Systems

    Sputtering is a LOW TEMPERATURE- HIGH ENERGY PVD process, where the target bombarded by ions, is vaporized and the vapours are deposited on the substrate creating a thin atomic layer.

    e-beam-and-thermal-evaporation-systems-kenosistec
    Evaporation Systems

    Evaporation is a LOW ENERGY PVD process and HIGH DEPOSITION rate where the material is heated based on the concept that above any material exists a finite “vapor pressure” .

    cathodic-arc-deposition-systems-kenosistec
    Cathodic ARC Equipment

    Cathodic Arc Plasma deposition is a HIGH ENERGY PVD process with HIGH DEPOSITION rate, mainly with LOW THERMAL conductive metals.

    thin-film-deposition-components-kenosistec
    Components

    Heaters and Coolers, Manipulators and special mechanical devices can be engineered under request.