KENOSISTEC Evaporation Systems (KE) have a cylindrical or cubic process chamber that can be fitted with several DEPOSITION sources: THERMAL, EFFUSION CELLS (specifically designed for perovskites and organic materials) and E-BEAM SOURCES.
The solid material is heated until vapor stage and reaches the substrate condensing on it . Popular & Simple: Two characteristics that mark this PVD technology.
A FULL CUSTOMIZABLE device can guarantee success in your current and future research.
- Single and/or Co-Evaporation
- Heating of the substrate’s holder up to 800°C
- lon Beam Etching and lon Beam ASSISTED DEPOSITION
The equipment can be provided with DOUBLE ROTATION, FLAT or DOME substrates holder
- A Load-Lock chamber can be added for speeding up chamber loading
- Samples pre-heating and/or for plasma treatment
Cathodic Arc Plasma deposition is a HIGH ENERGY PVD process with HIGH DEPOSITION rate, mainly with LOW THERMAL conductive metals.
The PVD technologies can be COMBINED in a POLYVALENT SOLUTION where two or more processes are required on a substrate, always keeping a clean deposition environment.
Plasma Enhaced Chemical Vapor Deposition is a technology with MEDIUM ENERGY and HIGH DEPOSITION RATE, that uses precursors on liquid or gaseous stage and its chemical componets are broken and then re...
Heaters and Coolers, Manipulators and special mechanical devices can be engineered under request.