R&D Systems
Sputtering Systems
KENOSISTEC supplies: Horizontal, Vertical and Confocal Sputtering Systems.
KENOSISTEC can manage the interactions involved in a Sputtering process TO DEVELOP a system configuration to GRANT UNIFORM and CONTROLLABLE DEPOSITIONS of single or multi-layers materials, including alloys.
Flexible Design (low maintenance cost) and CONFIGURATION (easy upgrade) can meet and exceed the most stringent requirements on performance, even with budget limitations. KENOSISTEC supplies: HORIZONTAL, VERTICAL and CONFOCAL Sputtering Systems.
Each CONFIGURATION can be supplied with the following features:
- Automatic SHUTTERS.
- Substrate RF or DC BIAS
- PROCESS GAS lines with MFC
- DC/RF HIGH DEPOSITION rate magnetron cathodes.
- NEW GENERATION control and software management.
- TOUCH SCREEN control
Typical features:
- The MOST FLEXIBLE in terms of substrates handling.
GENERAL FEATURES:
- CONFIGURATION: Sputter up or Sputter down
- SUBSTRATE HANDLING: all models include AUTOMATIC HANDLING of SUBSTRATE HOLDER
- SUBSTRATE HEATING or COOLING available (optional)
- PLANETARY ROTATION of the pallet can be added
- LOAD LOCK CHAMBER for "dual chamber" configuration or specific requirements (SINGLE SAMPLE OR CASSETTE)
- CO-SPUTTERING: Sequential or Confocal capabilities
- GAS & PRESSURE: Up to 5 independent Mass Flow Control
Typical features:
- The preferred for DEMANDING PRODUCTION environment process, minimizing particulate contamination.
GENERAL FEATURES:
- CONFIGURATION: Allow deposit on 3D samples and avoid target's flakes on substrates.
- SUBSTRATE HANDLING: all models include AUTOMATIC HANDLING of SUBSTRATE HOLDER
- SUBSTRATE HEATING or COOLING available (optional).
Typical features:
- IMPROVED FILM UNIFORMITY and PROCESS VERSATILITY allowing the use of reduced target size.
GENERAL FEATURES:
- CONFIGURATION: Sputter up or Sputter down
- SUBSTRATE HANDLING: all models include AUTOMATIC HANDLING of SUBSTRATE HOLDER.
- SUBSTRATE ROTATION: To improve deposition uniformity.
- CO-SPUTTERING: Shutter for each position and special shield to avoid cross contamination.
- GAS & PRESSURE: Up to 3 independent MFC's.
- PROCESS CONTROLLER: PC-PLC system fully automatic and manual operation.
- CO-SPUTTERING: Sequential or Confocal capabilities
- GAS & PRESSURE: Up to 5 independent Mass Flow Control
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