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R&D Systems

Sputtering Systems

KENOSISTEC supplies: Horizontal, Vertical and Confocal Sputtering Systems.

KENOSISTEC can manage the interactions involved in a Sputtering process TO DEVELOP a system configuration to GRANT UNIFORM and CONTROLLABLE DEPOSITIONS of single or multi-layers materials, including alloys.

  • vacuum-sputtering-system-kenosistec
  • kenosistec-pvd-sputtering-equipment
  • kenosistec-vacuum-sputtering-system

Flexible Design (low maintenance cost)  and CONFIGURATION (easy upgrade) can meet and exceed the most stringent requirements on performance, even with budget limitations. KENOSISTEC supplies: HORIZONTAL, VERTICAL and CONFOCAL Sputtering Systems.

Each CONFIGURATION can be supplied with the following features: 

  • Automatic SHUTTERS.
  • Substrate RF or DC BIAS
  • PROCESS GAS lines with MFC 
  • DC/RF HIGH DEPOSITION rate magnetron cathodes. 
  • NEW GENERATION control and software management.  
  • TOUCH SCREEN control

Typical features:

  • The MOST FLEXIBLE in terms of substrates handling.

GENERAL FEATURES:

  • CONFIGURATION: Sputter up or Sputter down
  • SUBSTRATE HANDLING: all models include AUTOMATIC HANDLING of SUBSTRATE HOLDER
  • SUBSTRATE HEATING or COOLING available (optional)
  • PLANETARY ROTATION of the pallet can be added
  • LOAD LOCK CHAMBER for "dual chamber" configuration or specific requirements (SINGLE SAMPLE OR CASSETTE)
  • CO-SPUTTERING: Sequential or Confocal capabilities
  • GAS & PRESSURE: Up to 5 independent Mass Flow Control

Typical features:

  • The preferred for DEMANDING PRODUCTION environment process, minimizing particulate contamination.

GENERAL FEATURES:

  • CONFIGURATION: Allow deposit on 3D samples and avoid target's flakes on substrates.
  • SUBSTRATE HANDLING: all models include AUTOMATIC HANDLING of SUBSTRATE HOLDER
  • SUBSTRATE HEATING or COOLING available (optional).

Typical features:

  • IMPROVED FILM UNIFORMITY and PROCESS VERSATILITY allowing the use of reduced target size.

GENERAL FEATURES:

  • CONFIGURATION: Sputter up or Sputter down
  • SUBSTRATE HANDLING: all models include AUTOMATIC HANDLING of SUBSTRATE HOLDER.
  • SUBSTRATE ROTATION: To improve deposition uniformity.
  • CO-SPUTTERING: Shutter for each position and special shield to avoid cross contamination.
  • GAS & PRESSURE: Up to 3 independent MFC's.
  • PROCESS CONTROLLER: PC-PLC system fully automatic and manual operation.
  • CO-SPUTTERING: Sequential or Confocal capabilities
  • GAS & PRESSURE: Up to 5 independent Mass Flow Control


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