Country and language:
Website:
R&D Systems

Sputtering Systems

Kenosistec supplies horizontal, vertical and confocal sputtering systems, able to manage the interactions present in a sputtering process and to develop a system configuration that guarantees uniform and controllable deposits of monolayer or multilayer materials (including alloys).

  • vacuum-sputtering-system-kenosistec
  • kenosistec-pvd-sputtering-equipment
  • kenosistec-vacuum-sputtering-system

The flexible design keeps maintenance costs low. The easily upgradeable configuration can meet and exceed the most stringent performance requirements, even with limited budgets. 

Each configuration can be supplied with the following features:

- Automatic closing / opening screens. Substrate polarization for RF or DC

- Process gas lines with mass flowmeters

- High deposition rate DC / RF magnetron cathode.

- Control and management through new generation software.

- Touch screen control

The most flexible in terms of substrate management.

General features:

- Configuration: sputter up or sputter down

- Substrate handling: all models include automatic handling of the substrate holder

- Support heating or cooling (optional)

- Possibility of adding planetary rotation of the pallet

- Load loading / unloading chamber for "double chamber" configuration or for specific needs (single sample or cassettes)

- Co-sputtering: sequential or confocal capabilities

- Gas & pressure: up to 5 independent mass flowmeters

The best for environmental manufacturing processes. Minimizes particulate contamination.

General features:

- Configuration: allows deposition on 3D samples and avoids the formation of target scales on substrates.

- Substrate handling: all models provide for automatic handling of the substrate holder

- Support heating or cooling (optional).

Improved film uniformity and process versatility to allow the use of smaller targets.

General features:

- Configuration: sputter up or sputter down

- Substrate handling: all models are provided for automatic handling of the substrate holder.

- Support rotation: to improve the uniformity of the deposition.

- Process controller: fully automatic PC-PLC system and manual operation.

- Co-sputtering: sequential or confocal capabilities

- Gas & pressure: up to 5 independent mass flowmeters

Related products
    e-beam-and-thermal-evaporation-systems-kenosistec
    Evaporation System

    The evaporation is a PVD process with low energy and high speed of deposition in which the solid material is finely heated at the rate of the evaporation state.In a second moment, the vapor thus o...

    cathodic-arc-deposition-systems-kenosistec
    Cathodic Arc Evaporation (CAE)

    Cathodic arc deposition is a high energy PVD evaporation process with a high deposition rate, mainly used with low heat conduction metals.

    reactive-ion-etching-system-kenosistec
    RIE (reactive ion etching) system

    The reactive ion etching (RIE) system is an ion-assisted reactive method based on a combination of chemical and physical etching that allows the removal of isotropic and anisotropic material.

    thin-film-deposition-components-kenosistec
    Components for thin film deposition

    From magnetron sources and cathode arc evaporation sources to power supplies: thanks to our vast experience in the production of vacuum systems, we offer the market the best components designed and ma...

Contact us
  • Viale delle scienze, 23, 20082 Binasco MI
  • Tel +39 02 9055200