Country and language:
Website:

R&D Systems

WE DEVELOP new ideas to bring SCIENCE to its full potential. How? UNDERSTANDING and TRANSFORMING the DEPOSITION PROCESS in pioneering solutions, matching RESEARCHERS and INSTITUTIONS needs.
pvd-sputtering-equipment-kenosistec
Sputtering Systems

Sputtering is a low-temperature, high-energy PVD process in which a target is bombarded with ions and vaporized, before being deposited on a substrate in the form of a thin atomic layer.

More information
e-beam-and-thermal-evaporation-systems-kenosistec
Evaporation System

The evaporation is a PVD process with low energy and high speed of deposition in which the solid material is finely heated at the rate of the evaporation state.

In a second moment, the vapor thus obtained reaches the substrate, condensing on it.


More information
cathodic-arc-deposition-systems-kenosistec
Cathodic Arc Evaporation (CAE)

Cathodic arc deposition is a high energy PVD evaporation process with a high deposition rate, mainly used with low heat conduction metals.

More information
reactive-ion-etching-system-kenosistec
RIE (reactive ion etching) system

The reactive ion etching (RIE) system is an ion-assisted reactive method based on a combination of chemical and physical etching that allows the removal of isotropic and anisotropic material.

More information
combined-coating-technologies-systems-kenosistec
PVD systems with combined technologies

Different techniques for thin film deposition can be applied in a polyvalent solution in cases where two or more processes are required on the same substrate, always maintaining a clean deposition environment.

Combined technology PVD systems are easy to use and highly performing. They are the perfect solution for academic and industrial, research and training laboratories.

More information
cluster-multi-chamber-vacuum-systems-kenosistec
Cluster

Each chamber can be designed to meet specific requirements by combining different processes (eg Sputtering, Evaporation, e-beam…). These systems are multifunctional, expandable, modular and therefore very flexible.

More information
pecvd-systems-thin-film-plasma-deposition-kenosistec
PECVD

PECVD, which stands for Plasma-enhanced chemical vapor deposition, is a plasma-enhanced chemical thin film deposition process.

More information
atomic-and-pulsed-layer-deposition-kenosistec
ALD systems (Atomic layer deposition) and PLD systems (Pulsed laser deposition)

ALD

Atomic Layer Deposition (ALD) is a technology that allows you to deposit high-density material, ensuring accurate uniformity.


PLD

Pulsed laser deposition (PLD) is a deposition technique specifically designed to operate in a UHV (i.e. Ultra High Vacuum) environment.

More information
gas-sensor-testing-chamber-kenosistec
Gas Sensor Test

The gas sensor test is a system designed to reproduce, with accuracy and repeatability, the specific environmental conditions required to test gas sensors.

More information
thin-film-deposition-components-kenosistec
Components for thin film deposition

From magnetron sources and cathode arc evaporation sources to power supplies: thanks to our vast experience in the production of vacuum systems, we offer the market the best components designed and manufactured for thin film deposition.

More information