Cathodic arc evaporation (CAE)
To vaporize the material from a cathode, an electric arc is used, allowing the material to condense on a substrate forming a thin film. It is a PVD technology known for more than a century, already widely used in the R&D field and recently also introduced in industries that require a resistant and decorative coating, where greater coverage and adhesion is required, especially in the presence of complex geometries.
Documents
Thanks to the cathodic arc deposition it is possible to obtain:
- high and efficient production of metal plasma,
- excellent mechanical properties like higher resistance to scratch of the coating
- wide range, constantly growing, of producible materials.
The chamber is water-cooled and can be equipped with a single or double rotation substrate holder for coating flat or 3D samples.
Each configuration can have the following characteristics:
- supports heated up to 400 ° C.
- insulated substrate holder for biasing and plasma cleaning.
- arc sources: 63 mm or 100 mm in diameter (of our design)
Optional Ion Source Plasma for cleaning non-conductive substrates.
Related products
Sputtering systems
Sputtering is a low-temperature, high-energy PVD process in which a target is bombarded with ions and vaporized, before being deposited on a substrate in the form of a thin atomic layer.
Evaporation system
The evaporation is a PVD process with low energy and high speed of deposition in which the solid material is finely heated at the rate of the evaporation state.
In a second moment, the vapor thus obtained reaches the substrate, condensing on it.
Cluster
Each chamber can be designed to meet specific requirements by combining different processes (eg Sputtering, Evaporation, e-beam…). These systems are multifunctional, expandable, modular and therefore very flexible.
Cathodic arc evaporation (CAE)
Cathodic arc deposition is a high energy PVD evaporation process with a high deposition rate, mainly used with low heat conduction metals.
RIE (reactive ion etching) system
The reactive ion etching (RIE) system is an ion-assisted reactive method based on a combination of chemical and physical etching that allows the removal of isotropic and anisotropic material.
PLD systems
PLD
Pulsed Laser Deposition offers a versatile and effective method for depositing thin films with precise control over composition, structure, and properties, making it a valuable technique in materials research and device fabrication.
PVD systems with combined technologies
Different techniques for thin film deposition can be applied in a polyvalent solution in cases where two or more processes are required on the same substrate, always maintaining a clean deposition environment.
Combined technology PVD systems are easy to use and highly performing. They are the perfect solution for academic and industrial, research and training laboratories.
Gas Sensor Test System
The gas sensor test is a system designed to reproduce, with accuracy and repeatability, the specific environmental conditions required to test gas sensors.
PECVD – Plasma Enhanced CVD
PECVD, which stands for Plasma-enhanced chemical vapor deposition, is a plasma-enhanced chemical thin film deposition process.
HI.P.PO.
Thanks to its deposit speed, HI.P.PO. competes with traditional evaporative metallization. Hi.P.Po. it is a magnetron sputtering, therefore more reproducible (repeating the same final characteristics regardless of the production batch), stable (uniformity during deposition) and calibratable (changing parameters), even on plastic (abs, polycarbonate, pmma).
Components for thin film deposition
From magnetron sources and cathode arc evaporation sources to power supplies: thanks to our vast experience in the production of vacuum systems, we offer the market the best components designed and manufactured for thin film deposition.