HI.P.PO.
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There are many industries that can benefit from the extraordinary versatility of this system: from the automotive and aerospace industries, to fashion and jewellery, from food packaging to the textile industry.
Hi.P.Po. can deposit many metals, including:
- Aluminum
- Titanium
- Chromium
- Copper
- Nickel
With this innovative Sputtering cathode, it is also possible to deposit composite materials of such metals, such as nitrides and carbides. Contact us to check if your deposit material has already been tested or if you want to evaluate the applicability of HI.P.Po.
- Minimum diameter: 70 mm
- Maximum diameter: 200 mm
- Height: can vary from 1000 mm up to 4000 mm
- Deposition rate 10 times higher than traditional planar cathodes
- Deposition temperatures compatible with many plastics (T <80 ° C).
- Custom size
- Reduction of the volume of the chamber by about 40%
- Low energy consumption
- Reduction of time and frequency of equipment maintenance
- Savings on the costs of target materials, combined with a reduction in their exchange and maintenance
Related products
Sputtering systems
Sputtering is a low-temperature, high-energy PVD process in which a target is bombarded with ions and vaporized, before being deposited on a substrate in the form of a thin atomic layer.
Evaporation system
The evaporation is a PVD process with low energy and high speed of deposition in which the solid material is finely heated at the rate of the evaporation state.
In a second moment, the vapor thus obtained reaches the substrate, condensing on it.
Cluster
Each chamber can be designed to meet specific requirements by combining different processes (eg Sputtering, Evaporation, e-beam…). These systems are multifunctional, expandable, modular and therefore very flexible.
Cathodic arc evaporation (CAE)
Cathodic arc deposition is a high energy PVD evaporation process with a high deposition rate, mainly used with low heat conduction metals.
RIE (reactive ion etching) system
The reactive ion etching (RIE) system is an ion-assisted reactive method based on a combination of chemical and physical etching that allows the removal of isotropic and anisotropic material.
PLD systems
PLD
Pulsed Laser Deposition offers a versatile and effective method for depositing thin films with precise control over composition, structure, and properties, making it a valuable technique in materials research and device fabrication.
PVD systems with combined technologies
Different techniques for thin film deposition can be applied in a polyvalent solution in cases where two or more processes are required on the same substrate, always maintaining a clean deposition environment.
Combined technology PVD systems are easy to use and highly performing. They are the perfect solution for academic and industrial, research and training laboratories.
Gas Sensor Test System
The gas sensor test is a system designed to reproduce, with accuracy and repeatability, the specific environmental conditions required to test gas sensors.
PECVD – Plasma Enhanced CVD
PECVD, which stands for Plasma-enhanced chemical vapor deposition, is a plasma-enhanced chemical thin film deposition process.
HI.P.PO.
Thanks to its deposit speed, HI.P.PO. competes with traditional evaporative metallization. Hi.P.Po. it is a magnetron sputtering, therefore more reproducible (repeating the same final characteristics regardless of the production batch), stable (uniformity during deposition) and calibratable (changing parameters), even on plastic (abs, polycarbonate, pmma).
Components for thin film deposition
From magnetron sources and cathode arc evaporation sources to power supplies: thanks to our vast experience in the production of vacuum systems, we offer the market the best components designed and manufactured for thin film deposition.