PVD systems with combined technologies

The strength of this configuration is the inclusion of the advantages and peculiarities of each deposition technique used within the same vacuum chamber, or in a chamber interconnected by means of a load-lock mechanism, to achieve the best possible coating performance.

The Kenosistec team is always available to identify the most suitable solution among the many combination possibilities, according to specific needs.

Some examples of combination of PVD technologies:

  • HiPims, dual magnetron sputtering with cathode arc evaporation sources.
  • The combination is specially designed to offer the best results for tribology coatings.
  • Sputtering, thermal evaporation and e-beam.
  • The solution is optimized for optics and microelectronics.
  • Sputtering and PECVD.
  • With this configuration it is possible to obtain a thin PVD film and a protective layer.
  • Sputtering and PLD.
  • The performance of standard sputtering is improved by adding higher density layers of different materials.
  • ALD, PLD etching and sputtering.
  • The combination is ideal for microelectronics, nanosensors, mems.
Contact our engineering team for more information.

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