Cluster

Sputtering is a low-temperature, high-energy PVD process in which a target is bombarded with ions and vaporized, before being deposited on a substrate in the form of a thin atomic layer.

The evaporation is a PVD process with low energy and high speed of deposition in which the solid material is finely heated at the rate of the evaporation state.
In a second moment, the vapor thus obtained reaches the substrate, condensing on it.

Each chamber can be designed to meet specific requirements by combining different processes (eg Sputtering, Evaporation, e-beam…). These systems are multifunctional, expandable, modular and therefore very flexible.

Cathodic arc deposition is a high energy PVD evaporation process with a high deposition rate, mainly used with low heat conduction metals.

The reactive ion etching (RIE) system is an ion-assisted reactive method based on a combination of chemical and physical etching that allows the removal of isotropic and anisotropic material.

PLD
Pulsed Laser Deposition offers a versatile and effective method for depositing thin films with precise control over composition, structure, and properties, making it a valuable technique in materials research and device fabrication.

Different techniques for thin film deposition can be applied in a polyvalent solution in cases where two or more processes are required on the same substrate, always maintaining a clean deposition environment.
Combined technology PVD systems are easy to use and highly performing. They are the perfect solution for academic and industrial, research and training laboratories.

The gas sensor test is a system designed to reproduce, with accuracy and repeatability, the specific environmental conditions required to test gas sensors.

PECVD, which stands for Plasma-enhanced chemical vapor deposition, is a plasma-enhanced chemical thin film deposition process.

Thanks to its deposit speed, HI.P.PO. competes with traditional evaporative metallization. Hi.P.Po. it is a magnetron sputtering, therefore more reproducible (repeating the same final characteristics regardless of the production batch), stable (uniformity during deposition) and calibratable (changing parameters), even on plastic (abs, polycarbonate, pmma).

From magnetron sources and cathode arc evaporation sources to power supplies: thanks to our vast experience in the production of vacuum systems, we offer the market the best components designed and manufactured for thin film deposition.