Sputtering systems
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Each configuration can be supplied with the following features:
- Automatic closing / opening screens. Substrate polarization for RF or DC
- Process gas lines with mass flowmeters
- High deposition rate DC / RF magnetron cathode.
- Control and management through new generation software.
- Touch screen control
The flexible design keeps maintenance costs low. The easily upgradeable configuration can meet and exceed the most stringent performance requirements, even with limited budgets.
The most flexible in terms of substrate management.
General features:
- Configuration: sputter up or sputter down
- Substrate handling: all models include automatic handling of the substrate holder
- Support heating or cooling (optional)
- Possibility of adding planetary rotation of the pallet
- Load loading / unloading chamber for “double chamber” configuration or for specific needs (single sample or cassettes)
- Co-sputtering: sequential or confocal capabilities
- Gas & pressure: up to 5 independent mass flowmeters
The best for environmental manufacturing processes. Minimizes particulate contamination.
General features:
- Configuration: allows deposition on 3D samples and avoids the formation of target scales on substrates.
- Substrate handling: all models provide for automatic handling of the substrate holder
- Support heating or cooling (optional).
Improved film uniformity and process versatility to allow the use of smaller targets.
General features:
- Configuration: sputter up or sputter down
- Substrate handling: all models are provided for automatic handling of the substrate holder.
- Support rotation: to improve the uniformity of the deposition.
- Process controller: fully automatic PC-PLC system and manual operation.
- Co-sputtering: sequential or confocal capabilities
- Gas & pressure: up to 5 independent mass flowmeters
In Line Sputtering Systems are designed for high production volumes in 2D substrates
General Features:
Kenosistec in-line systems are vacuum deposition solutions designed for high-performance continuous production. Engineered to ensure coating uniformity, process reliability, and high productivity, they enable the treatment of different substrates with customizable configurations tailored to specific application needs. They are ideal for sectors that require precision, consistent quality, and maximum production efficiency.
Related products
Evaporation system
The evaporation is a PVD process with low energy and high speed of deposition in which the solid material is finely heated at the rate of the evaporation state.
In a second moment, the vapor thus obtained reaches the substrate, condensing on it.
Cathodic arc evaporation (CAE)
Cathodic arc deposition is a high energy PVD evaporation process with a high deposition rate, mainly used with low heat conduction metals.
RIE (reactive ion etching) system
The reactive ion etching (RIE) system is an ion-assisted reactive method based on a combination of chemical and physical etching that allows the removal of isotropic and anisotropic material.
PVD systems with combined technologies
Different techniques for thin film deposition can be applied in a polyvalent solution in cases where two or more processes are required on the same substrate, always maintaining a clean deposition environment.
Combined technology PVD systems are easy to use and highly performing. They are the perfect solution for academic and industrial, research and training laboratories.
Cluster
Each chamber can be designed to meet specific requirements by combining different processes (eg Sputtering, Evaporation, e-beam…). These systems are multifunctional, expandable, modular and therefore very flexible.
PECVD – Plasma Enhanced CVD
PECVD, which stands for Plasma-enhanced chemical vapor deposition, is a plasma-enhanced chemical thin film deposition process.
PLD systems
PLD
Pulsed Laser Deposition offers a versatile and effective method for depositing thin films with precise control over composition, structure, and properties, making it a valuable technique in materials research and device fabrication.
Gas Sensor Test System
The gas sensor test is a system designed to reproduce, with accuracy and repeatability, the specific environmental conditions required to test gas sensors.
Components for thin film deposition
From magnetron sources and cathode arc evaporation sources to power supplies: thanks to our vast experience in the production of vacuum systems, we offer the market the best components designed and manufactured for thin film deposition.
HI.P.PO.
Thanks to its deposit speed, HI.P.PO. competes with traditional evaporative metallization. Hi.P.Po. it is a magnetron sputtering, therefore more reproducible (repeating the same final characteristics regardless of the production batch), stable (uniformity during deposition) and calibratable (changing parameters), even on plastic (abs, polycarbonate, pmma).