In-Line Systems
In-Line Systems
Production systems in which substrates are transported continuously through a sequence of process chambers, each dedicated to a specific stage of the production cycle. Kenosistec in-line PVD systems are built around a single goal: faster, more reliable, tailor-made production.
Kenosistec in-line systems carry substrates through dedicated chambers in sequence, from loading to unloading, in a continuous and repeatable flow. This architecture delivers high throughput, process uniformity and lower cost per part, from pilot line to volume production.
Every system is designed around the customer’s needs. We combine the deposition techniques best suited to the material, the substrate and the required functionality:
- Magnetron sputtering (DC, pulsed DC, RF, HiPIMS): for metal, oxide and nitride films, including reactive mode, with planar or rotatable cathodes.
- Thermal evaporation: for metals and compounds with low evaporation temperatures, ideal for contacts, mirrors and functional layers.
- Electron-beam evaporation: for refractory materials and optical oxides, with high purity and precise control of the deposition rate.
- PECVD: for dielectric and passivation films, such as silicon nitrides and oxides, at moderate temperatures.
- Ion and plasma sources: for cleaning, surface activation and film growth assistance, for better adhesion and density.
These techniques can be integrated within the same line. A single system can therefore prepare the surface, deposit a multilayer stack and protect it with a final coating, without breaking vacuum between steps.
Substrate size, number of chambers, transport systems and process control are all configurable. From research to industry, the system grows with your product.
Related products
In-Line Systems
Lo sputtering è un processo PVD a bassa temperatura-alta energia nel quale un target viene bombardato da ioni e vaporizzato, per poi essere depositato su un substrato sotto forma di un sottile strato atomico.
Evaporation system
The evaporation is a PVD process with low energy and high speed of deposition in which the solid material is finely heated at the rate of the evaporation state.
In a second moment, the vapor thus obtained reaches the substrate, condensing on it.
Cathodic arc evaporation (CAE)
Cathodic arc deposition is a high energy PVD evaporation process with a high deposition rate, mainly used with low heat conduction metals.
RIE (reactive ion etching) system
The reactive ion etching (RIE) system is an ion-assisted reactive method based on a combination of chemical and physical etching that allows the removal of isotropic and anisotropic material.
PVD systems with combined technologies
Different techniques for thin film deposition can be applied in a polyvalent solution in cases where two or more processes are required on the same substrate, always maintaining a clean deposition environment.
Combined technology PVD systems are easy to use and highly performing. They are the perfect solution for academic and industrial, research and training laboratories.
Cluster
Each chamber can be designed to meet specific requirements by combining different processes (eg Sputtering, Evaporation, e-beam…). These systems are multifunctional, expandable, modular and therefore very flexible.
PECVD – Plasma Enhanced CVD
PECVD, which stands for Plasma-enhanced chemical vapor deposition, is a plasma-enhanced chemical thin film deposition process.
PLD systems
PLD
Pulsed Laser Deposition offers a versatile and effective method for depositing thin films with precise control over composition, structure, and properties, making it a valuable technique in materials research and device fabrication.
Gas Sensor Test System
The gas sensor test is a system designed to reproduce, with accuracy and repeatability, the specific environmental conditions required to test gas sensors.
Components for thin film deposition
From magnetron sources and cathode arc evaporation sources to power supplies: thanks to our vast experience in the production of vacuum systems, we offer the market the best components designed and manufactured for thin film deposition.
HI.P.PO.
Thanks to its deposit speed, HI.P.PO. competes with traditional evaporative metallization. Hi.P.Po. it is a magnetron sputtering, therefore more reproducible (repeating the same final characteristics regardless of the production batch), stable (uniformity during deposition) and calibratable (changing parameters), even on plastic (abs, polycarbonate, pmma).